Today's Top SOA Links
From the Wires
CEVA to Showcase Industry-Leading Platform IP for Communications, Vision, Imaging, Audio and Voice at Mobile World Congress 2013
Unrivalled suite of mobile IP on display includes software-based Wi-Fi 802.11ac; software-based image enhancement & computer vision; advanced audio post-processing, voice pre-processing and voice activation. Visit CEVA at Stand 7i70, Hall 7
By: PR Newswire
Feb. 13, 2013 07:02 AM
MOUNTAIN VIEW, Calif., Feb. 13, 2013 /PRNewswire/ -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced that it will demonstrate its industry leadership in platform IP for advanced mobile applications at Mobile World Congress 2013. CEVA will also showcase a wide range of LTE smartphones & tablets, low cost smartphones and other mobile computing devices from the world's leading OEMs, all powered by CEVA DSPs. Illustrating the company's position as the world's #1 DSP architecture deployed in mobile devices, CEVA DSPs power 46%^ of the world's cellular basebands today, and have shipped in more than three billion handsets to date.
Technologies on display at CEVA's stand will include:
In addition, more than fifty CEVA customers, partners and OEMs will display a wide range of CEVA-powered products and devices at the show, including Acer, Broadcom, Coolpad, Haier, HTC, Huawei, Intel, InterDigital, Konka, Lenovo, LG, Mindspeed, Motorola, Nokia, Samsung, SIMCom, ST-Ericsson, Telit, u-Blox, ZTE, and many more.
Mobile World Congress 2013 takes place in Barcelona, Spain from February 25th to 28th. CEVA will be located at stand 7i70 in Hall 7. To request a meeting with CEVA please email email@example.com or contact your local CEVA sales office.
About CEVA, Inc.
CEVA is the world's leading licensor of silicon intellectual property (SIP) DSP cores and platform solutions for the mobile, portable and consumer electronics markets. CEVA's IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia (vision, imaging and HD audio), voice processing, Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2012, CEVA's IP was shipped in more than 1 billion devices, powering smartphones from many of the world's leading OEMs, including HTC, Huawei, Lenovo, LG, Nokia, Motorola, Samsung, Sony, TCL and ZTE. Today, more than 40% of handsets shipped worldwide are powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com. Follow CEVA on twitter at www.twitter.com/cevadsp.
^Source: Strategy Analytics – Baseband Market Share Tracker, March 2013
SOURCE CEVA, Inc.
Web 2.0 Latest News
Subscribe to the World's Most Powerful Newsletters
Subscribe to Our Rss Feeds & Get Your SYS-CON News Live!
SYS-CON Featured Whitepapers
Most Read This Week