yourfanat wrote: I am using another tool for Oracle developers - dbForge Studio for Oracle. This IDE has lots of usefull features, among them: oracle designer, code competion and formatter, query builder, debugger, profiler, erxport/import, reports and many others. The latest version supports Oracle 12C. More information here.

2008 West
Data Direct
SOA, WOA and Cloud Computing: The New Frontier for Data Services
Red Hat
The Opening of Virtualization
User Environment Management – The Third Layer of the Desktop
Cloud Computing for Business Agility
CMIS: A Multi-Vendor Proposal for a Service-Based Content Management Interoperability Standard
Freedom OSS
Practical SOA” Max Yankelevich
Architecting an Enterprise Service Router (ESR) – A Cost-Effective Way to Scale SOA Across the Enterprise
Return on Assests: Bringing Visibility to your SOA Strategy
Managing Hybrid Endpoint Environments
Game-Changing Technology for Enterprise Clouds and Applications
Click For 2008 West
Event Webcasts

2008 West
Get ‘Rich’ Quick: Rapid Prototyping for RIA with ZERO Server Code
Keynote Systems
Designing for and Managing Performance in the New Frontier of Rich Internet Applications
How Can AJAX Improve Homeland Security?
Beyond Widgets: What a RIA Platform Should Offer
REAs: Rich Enterprise Applications
Click For 2008 Event Webcasts
Today's Top SOA Links

Research and Markets: LED Packaging 2013 Report: Packaging Cost Reduction is Driving New Technology and Design Adoption

Research and Markets ( has announced the addition of the "LED Packaging 2013" report to their offering.

Packaging cost reduction is driving new technology and design adoption, and fueling a booming equipment and material market.


Depending on the device type, packaging can represent 40% to 60% of LED total cost. As such, packaging represents the single-largest opportunity for cost reduction, which is required in order for the industry to access the Holy Grail that is General Lighting. However, if you're expecting this cost reduction to come from standardization, you can abandon all hope. The creativity of LED engineers and specificities of each application have led to an infinite number of package type and formats: Single or multiple chips, low and middle-power Plastic Leaded Chip Carrier (PLCC), ceramic-based high-power LED, small and large arrays, Chip On Board (COB), etc. This profusion of styles is inhibiting LED manufacturing cost reduction by multiplying the Stock keeping Unit (SkU), thus preventing standardization of the manufacturing process and the associated economies of scale.

In this context, LED manufacturers are reacting by developing new manufacturing philosophies/concepts, such as:

- Design for manufacturing, which consists of trying to simplify and standardize elements whenever possible, and push differentiation as far downstream as possible in the manufacturing process.

- Design for cost, which consists of favoring cost of ownership or cost per lumen over end performance.

Technological developments are also impacted by the quest for cost reduction, and LED manufacturers are now searching for equipment and/or materials with the right mix between cost and performance. As a matter of fact, equipment and materials suppliers are proposing more and more equipment and materials that fit these requirements, i.e. laser-based dicer, low-cost ceramic package substrate, etc.

In the end, LEDs are going mainstream but are still not a mature commodity! This is good news for the entire industry, since design and materials innovation still provides opportunity for differentiation. All of this benefits the consumer, who receives budget-friendly, environmentally friendly and increasingly credible LED-based alternatives for replacing traditional light sources.

This report represents a comprehensive overview of all technological aspects of LED packaging. It describes each step of the packaging process flow, discusses the associated technological breakthroughs, provides a summary of key players, and much more!


The objectives of the report are the following:

- To better understand process flow and technological trends in LED packaging

- To better understand the importance of cost reduction in LED packaging

- To better understand who is doing what

- To provide market metrics both at LED and material/equipment levels


- Update of all market metrics (packaged LED, equipment, materials)

- Highlight of 2012 LED packaging trends (design, new technologies and materials per process step )

- Additional analysis (wafer bonding, thermal management at the LED module level)


- Detailed technical analysis of each LED packaging process step

- LED market metrics (units and value): Forecast 2011 - 2017

- Packaging equipment market metrics (units and value): Forecast 2011 - 2017

- Packaging material market metrics (units and value): Forecast 2011 -2017

- Technology road-map for adoption of new technologies

- Supply chain analysis for each LED packaging process step

Key Topics Covered:

1 Executive Summary

2 LED Market Overview

3 LED Packaging Overview

4 Wafer Bonding

5 Wafer Bonding

6 Die Singulation

7 Thermal Management - Packaging Substrates (Including COB)

8 Thermal Management - Module Substrates (Including COH)

9 ESD Protection

10 Die Attach / Die Bonding

11 Interconnects

12 Encapsulation and Optics

13 Phosphors

14 Wafer Level Packaging

15 Testing and Binning

General Conclusion

Companies Mentioned: Click the link below to view the list of 160 companies featured in this extensive report.

For more information visit

About Business Wire
Copyright © 2009 Business Wire. All rights reserved. Republication or redistribution of Business Wire content is expressly prohibited without the prior written consent of Business Wire. Business Wire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

Web 2.0 Latest News
Certain CIOs for incomprehensible reasons keep off their cloud transformation projects several key IT disciplines including Enterprise Architecture (EA), IT Service Management (ITSM) and most importantly Project Management. Do they consider them obsolete? useless? irrelevant? ITaaS St...
In today’s pharmaceutical supply chain, counterfeit activity is thriving. As pharma companies have expanded target markets and outsourced production over the last decade, the supply chain has become increasingly global, virtual, and vulnerable. Illicit activity has thrived, and patient...
Here’s the thing: as sure as we’ll have another record-setting year for NFL streaming, you can also be sure that apps will fail and streaming services will go down. Whether you are dabbling in streaming or diving in whole-hog, you need to know what to do to give your users the most rel...
This is how a typical software product lifecycle works : You gather requirements, build a prototype, detail out the architecture and design, develop the product, test it, deploy the product, handle migration and maintenance and ensure product support. This is a closed loop where the Pr...
Intuit uses deep-data analytics to gain a 360-degree view of its TurboTax application's users’ behavior and preferences for rapid applications improvements. The next BriefingsDirect big-data innovation case study highlights how Intuit uses deep-data analytics to gain a 360-degree view...
Subscribe to the World's Most Powerful Newsletters
Subscribe to Our Rss Feeds & Get Your SYS-CON News Live!
Click to Add our RSS Feeds to the Service of Your Choice:
Google Reader or Homepage Add to My Yahoo! Subscribe with Bloglines Subscribe in NewsGator Online
myFeedster Add to My AOL Subscribe in Rojo Add 'Hugg' to Newsburst from CNET Kinja Digest View Additional SYS-CON Feeds
Publish Your Article! Please send it to editorial(at)!

Advertise on this site! Contact advertising(at)! 201 802-3021

SYS-CON Featured Whitepapers