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Printed Electronics Version 3.0: A Market Forecast

NEW YORK, Dec. 10, 2012 /PRNewswire/ -- announces that a new market research report is available in its catalogue:

Printed Electronics Version 3.0: A Market Forecast


The report quantifies these opportunities in terms of revenues generated by PE V3.0 at three levels of the value chain.  In addition, to an eight-year forecast of PE-enabled products, the report also contains projections of PE components and specialist inks.  The components covered are thin-film transistors, memories, batteries, sensors, displays and lighting.  The organizations discussed include: Agilent, Bank of America, Bemis, DuPont Teijin, eBay, E Ink, Enfucell, Esquire Magazine, Fujifilm Dimatix, GE, Gemalto, HelioVolt, Holst Centre, ISET, Jenn Feng, Kovio, MasterCard, Merck, Mitsubishi, Panasonic, Nanosolar, Oxford Photovoltaics, PARC, Pioneer, PolyIC, PragmaticIC, Pragmatic Printing, Plastic Logic, Printed Electronics Limited, Qolpac, Samsung, Seiko Epson, SolarPrint, Sumitomo, Thin Film Electronics, Tokyo Electron, and UDC.



1.1 Printing as Strategy and Printing as Tactics:  An Approach to Market Segmentation

1.2 Objectives and Coverage of this Report

1.3 Printed Electronics:  The First Two Phases and their Consequences

1.3.1 Printed Electronics Phase I:  Printed Electronics is Thick-Film Electronics

1.3.2 Printed Electronics Phase II:  Printed Electronics as a New Industry

1.4 Printed Electronics V3.0:  The New PE

1.5 Short-to-Medium Term Applications for Printed Electronics

1.5.1 Smart Packaging:  Pharma, Food and Brand Enhancement

1.5.2 PE and Security Printing

1.5.3 Smart Cards: Adding Printed Batteries and Displays for Enhanced Security

1.5.4 Medical Devices:  Patches, Bandages and Diagnostics

1.5.5 PE and Biochips

1.5.6 Interactive Media and Disposable Electronics

1.6 Longer-Term Opportunities for PE V3.0

1.6.1 Displays for Mobile Devices and Televisions

1.6.2 Printed Lighting

1.6.3 Printed Solar Panels

1.7 Supply Chain and Ecosystem Opportunities

1.8 Opportunities for the Printing/Printing Equipment Industry:  Printing Electronics Isn't As Easy as it Looks!

1.9 Eight-Year Forecasts of Products Enabled by PE V3.0


2.1 Printed Electronic Components: Mostly Still Evolving

2.1.1 Processors and Memories:  Organic or Silicon

2.1.2 Printed Displays:  Technology Options

2.1.3 Printed Lighting:  Current Projects

2.1.4 Printed Sensors

2.1.5 RFID and Lesser Tagging

2.1.6 Printed Batteries

2.1.7 Evolution of Printed Photovoltaics Technology

2.2 Printed Electronics in Packaging:  Why Packaging Must Become Smart

2.2.1 The Limitations of Smart Packaging as a Target Market for PE

2.2.2 Food and Personal Care Smart Packaging Applications

2.2.3 Pharmaceutical and Healthcare-Related Smart Packaging:  Compliance Packaging

2.2.4 Brand Security

2.2.5 Eight-Year Market Forecast of PE-Enabled Smart Packaging

2.3 A Growing Need for Powered Smart Cards

2.3.1 Smart Card Chips

2.3.2 Printed Batteries and Displays in Powered Smart Cards

2.3.3 Eight-Year Market Forecast of PE-Enabled Smart Cards

2.4 PE Innovations for Medical Devices and Disposables

2.4.1 Medical and Cosmetic Patches

2.4.2 Smart Bandages

2.4.3 CPR Cards

2.4.4 Eight-Year Market Forecast of PE-Enabled Medical Devices

2.5 Interactive Printed Media and Disposable Electronics

2.5.1 Some Skeptical Thoughts on This Sector

2.5.2 Eight-Year Market Forecast of PE-Enabled Disposable Electronics and Interactive Printed Media

2.6 Printed Displays for Mobile Devices and Televisions

2.6.1 Eight-Year Market Forecast of PE-Enabled Mobile and TV Displays

2.7 Printed OLED Lighting

2.8 Printed Solar Cells

2.9 Summary of PE V3.0 Components Forecasts


3.1 Electronic Inks:  Current and Future Materials

3.1.1 The Future of PE Inks

3.1.2 Printing Processes That Are Being Used in the PE V3.0 Era

3.2 Conductive Inks and Pastes for PE V3.0

3.2.1 Silver and Nano-Silver Inks

3.2.2 Gold Inks

3.2.3 Copper Inks

3.2.4 Other Metallic Inks and Polymer Electrodes

3.2.5 Transparent Conductor Inks

3.3 Semiconductor Inks for PE V3.0

3.3.1 Organic Semiconductors and Printing

3.3.2 Silicon Inks and Electronics

3.3.3 Other Semiconductor Inks and Materials Sets:  Is PE V3.0 CMOS Possible?

3.4 Some Thoughts on Printed Carbon Nanotubes and Graphene in the Future of Printed Electronics

3.5 Substrate and Encapsulants for PE V3.0 Applications

3.5.1 The Future of PE Substrates

3.5.2 Some Notes on Encapsulation for PE V3.0

3.6 Eight-Year Forecasts of PE 3.0 Inks

Acronyms and Abbreviations Used In this Report

About the Author


Exhibit 1-1: The Three Phases of Printed Electronics Development

Exhibit 1-2: Market Segmentation

Exhibit 1-3: Summary of Final Market Value of PE 3.0 Enabled Products with a High PE V3.0 Content

Exhibit 2-1: Printed Components Used in Next-Generation Low-Cost Printed Electronics Applications

Exhibit 2-2: OTFT/OFET Device Performance Trends

Exhibit 2-3: Overview of Prospects for Low-Performance Applications for Organic/Printed Logic and Memory

Exhibit 2-4: Survey of Printed Sensor Research Devices

Exhibit 2-5: Advantages of Printing for Fabricating Large-Area Sensors

Exhibit 2-6: Printed CIGS Firms

Exhibit 2-7: Eight-Year Market Forecast of Component-Level Revenues Generated by PE-Enabled Smart Packaging ($ Millions)

Exhibit 2-8: Eight-Year Market Forecast of Component-Level Revenues Generated by PE-Enabled Smart Cards ($ Millions)

Exhibit 2-9: Eight-Year Market Forecast of Component-Level Revenues Generated by PE-Enabled Medical Devices ($ Millions)

Exhibit 2-10: Eight-Year Market Forecast of Component-Level Revenues Generated by Disposable Electronics/Interactive Printed Media ($ Millions)

Exhibit 2-11: Eight-Year Market Forecast of PE Revenues Generated by Mobile Devices and Televisions Display Modules ($ Millions)

Exhibit 2-12: Eight-Year Market Forecast of Printed OLED Lighting Panels ($ Millions)

Exhibit 2-13: Eight-Year Market Forecast of PE Revenues Generated by PV Panels ($ Millions)

Exhibit 2-14: Summary of Market Value of PE V3.0 Components by Application  ($ Millions)

Exhibit 2-15: Summary of Market Value of PE V3.0 Components and Materials by Type

Exhibit 3-1: Comparison of Common Printing Processes Used In Printed Electronics

Exhibit 3-2: Major Conductors:  Rankings of Main Characteristics

Exhibit 3-3: Summary of Market Value of Selected PE V3.0 Inks by Type  ($ Millions)

To order this report:

Manufacturing Industry: Printed Electronics Version 3.0: A Market Forecast

Contact Nicolas:
US: (805)-652-2626
Intl: +1 805-652-2626

SOURCE Reportlinker

About PR Newswire
Copyright © 2007 PR Newswire. All rights reserved. Republication or redistribution of PRNewswire content is expressly prohibited without the prior written consent of PRNewswire. PRNewswire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

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